The RADISH team had the pleasure of participating in the General Meeting of the MecaNano COST Action (CA21121), which took place in Rome. The event brought together researchers from across Europe working on the mechanical behavior of nanostructured materials and provided an excellent opportunity to exchange ideas, discuss recent advances, and strengthen international collaborations.
We are especially proud that two members of our team actively presented their research during the meeting. Hanna Szebesczyk delivered an oral presentation entitled “Application of High-Throughput Materials Science Methods for Rapid Screening and Optimization of Ultra-Strong Light-Weight Alloys.” Her talk highlighted how high-throughput experimental approaches can significantly accelerate the development of advanced lightweight materials with exceptional mechanical properties. In addition, Maria Kanczewska presented a scientific poster titled “Effect of Deposition Temperature on the Microstructure of W-Cr Thin-Film Material Libraries.” The poster focused on how deposition temperature influences the microstructure of tungsten-chromium thin films, contributing to the optimization of materials for demanding applications. Krzysztof Wieczerzak also presented a scientific poster entitled “Data-Driven Exploration of the Compositional Hyperspace of Refractory High-Entropy Alloys via High-Throughput Materials Engineering,” demonstrating how data-driven approaches and high-throughput methods can be used to accelerate the discovery of advanced high-temperature alloys.
Participation in the meeting was a valuable opportunity to present the goals and progress of the RADISH project, receive constructive feedback, and engage with leading experts in the field of nanomaterials and advanced characterization. We would like to sincerely thank the organizers of the MecaNano COST Action for hosting such a well-organized and inspiring event. We are grateful to have been part of this outstanding scientific community and look forward to future collaborations and meetings.
